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  1. Abstract

    We report threshold voltage (VTH) control in ultrawide bandgap Al0.4Ga0.6N-channel metal oxide semiconductor heterostructure field-effect transistors using a high-temperature (300 °C) anneal of the high-kZrO2gate-insulator. Annealing switched the polarity of the fixed charges at the ZrO2/AlGaN interface from +5.5 × 1013cm−2to −4.2 × 1013cm−2, pinningVTHat ∼ (−12 V), reducing gate leakage by ∼103, and improving subthreshold swing 2× (116 mV decade−1). It also enabled the gate to repeatedly withstand voltages from −40 to +18 V, allowing the channel to be overdriven doubling the peak currents to ∼0.5 A mm−1.

     
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  2. Abstract We demonstrate fully fabricated AlGaN/GaN high electron mobility transistors (HEMTs) transferred from sapphire to copper tape on flexible polyethylene terephthalate using 193 nm excimer laser liftoff (LLO). The heterojunction is structurally intact after LLO, leading to preserved electron mobility μ n ∼1630 cm 2 V −1 s −1 and carrier concentration n s ∼10 13 cm −2 . The maximum drain saturation current decreased by ∼18% after transfer, which is a lower reduction than other reported transfer methods. The drain current of this flexible HEMT increased monotonically under tensile stress applied using a convex-shaped plate, while the threshold voltage shifted more negative in quantitative agreement with the expected piezoelectric charge for an intact heterojunction. 
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  3. null (Ed.)
  4. We report an Ultrawide Bandgap Al0.4Ga0.6N channel Metal-Oxide-Semiconductor Heterostructure field effect transistor with drain currents exceeding 1.33 A/mm (pulse) and 1.17A/mm (DC), around 2-fold increase over reported for AlGaN HFETs. The increase was achieved by incorporating hybrid barrier layer consisting of an AlN spacer, n-doped Al0.6Ga0.4N barrier and a thin reverse graded AlxGa1-xN (x from 0.60 to 0.30) cap layer. To enhance current spreading, a "perforated" channel layout comprising of narrow channel sections separated by current blocking islands was used. A composite ALD deposited ZrO2/Al2O3 film was used as gate dielectric. A breakdown field above 2MV/cm was measured. 
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